Job Responsibilities:
1.Responsible for new product introduction, sample prototyping, pilot production and mass production transfer, and evaluate process feasibility.
2.Formulate production processes, reflow temperature profiles, stencil solutions and work instruction documents.
3.Resolve various process defects in printing, mounting and reflow soldering, implement process improvements and enhance production yield.
4.Collaborate with R&D, quality and production departments, handle engineering changes and abnormality analysis, and issue 8D reports.
5.Optimize SMT process parameters and fixtures, and follow up the introduction and implementation of new processes and new materials.
Job Requirements:
1.Bachelor’s degree or above, major in Electronics, Mechatronics, Automation or related fields; 3–5 years of working experience in SMT/NPI.
2.Familiar with the entire SMT process flow; proficient in process debugging of solder paste printing, component mounting and reflow soldering.
3.Able to read PCB, BOM and Gerber data; skilled in analysis and improvement of process defects.
4.Knowledgeable about lead-free process and quality management system.
5.Working experience in circuit board, industrial control electronics or automotive electronics industry is preferred.
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